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Semiconductor Manufacturing Applications
The sensor component-level product integrates a patch head, suction nozzle, and carrier, enabling real-time detection of whether components like capacitors and resistors are correctly placed, missing, or misaligned on the PCB. Data is fed back within milliseconds, allowing for closed-loop correction of mounting accuracy and ensuring high-density packaging succeeds on the first attempt. Additionally, its low-outgassing and anti-static design make it ideal for clean production environments, providing long-term, stable protection to maintain optimal yield in semiconductor post-processing.
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Address: Building 13, 4th Floor, Room 688, Xiuyuan, Dachengli, Fengtai District, Beijing